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PCB High-Current Conductors

SMT Busbars

SMT BUSBARS

Board-level current reinforcement, heat spreading and power distribution, configurable by dimensions, material, finish, soldering process and tape-and-reel requirements.

This page describes a product family and selection inputs. Confirm current rating, temperature rise, tolerances, certification scope and lead time against the selected part, drawing and valid records. Illustrations are not product or factory evidence. Cu-Al figures come from supplied material documents and apply only to their samples and conditions, not a blanket certification or system cost guarantee.

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Drawing & ToleranceConfirm for the selected part

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Electrical & ThermalValidate the actual assembly

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SMT & PackagingConfirm feeding and reflow

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Evidence & AcceptanceCheck sample, lot and scope

Start Product Inquiry→⚡ Preliminary Estimate

CUNECTRA · PCB HARDWARE

ENGINEERING TOOL

SMT Busbar Current & Budget Estimate

Simplified rectangular-conductor and non-binding budget estimates. Confirm with actual assembly testing and a formal quotation.

Quick Presets:

1. Dimensions (mm)Vol: 60 mm³ · Area: 6 mm²

Length L10 mm

Width W4 mm

Thickness H1.5 mm

2. Material & Plating

Copper (model: 1.724×10⁻⁸ Ω·m)H65 Brass

Surface PlatingMounting Orientation

3. Thermal Rise & Volume

Allowable Temp Rise ΔT+45 °C

Ta=40°C → Tmax=85°C

Purchase Quantity10,000 pcs

Preliminary estimate, not a product rating or quotation; validate the actual PCB, contacts and cooling.

Simplified Current Estimate

26.7A

Model Temperature85 °C

Current Density4.45 A/mm²

Conductor Resistance (Model Temperature)

0.036mΩ

Excludes contact and joint resistance

Voltage Drop & Loss

0.96mV

0.026 W @ 26.7A

Equal-Section 2oz Copper Width

85.7mm

Geometric area comparison only; not thermally equivalent

Carrier Tape Width

24mm T&R

Geometry estimate; confirm pocket and feeder

Estimated Unit PriceBased on 10,000 pcs progressive stamping + reel packaging

$0.0439/pcs

Budget uses fixed reference parameters and quantity/material/finish factors. 1 CNY=0.138 USD is a model constant, not live FX. Tooling, taxes, freight, metal market prices and testing are not project-quoted. Obtain a formal quotation.

Start RFQ with this Spec ↗

Model & Scope · v2026-09-26

Steady-state solid rectangular conductor; fixed 40°C ambient, model temperature=40°C+selected rise. I=√[h·2(w+t)·w·t·ΔT/ρ(T)] in SI units; h=5.2 flat or 6.9 vertical W/(m²·K). Copper ρ20=1.724×10⁻⁸ Ω·m, α=0.00393/K; brass ρ20=6.2×10⁻⁸ Ω·m, α=0.002/K. ρ(T)=ρ20[1+α(T−20)], R=ρ(T)L/(wt), V=IR, P=I²R. Excludes PCB current sharing, solder/contact resistance, enclosure, forced cooling, AC skin effect and transients. No published test-calibration record is available.

TECHNICAL SPECIFICATIONS

Parameters & Engineering Standards

Standardized replacement models and customized dimensions tailored to your PCB footprint and thermal budget.

Engineering Dimension	Specification & Standard
Product forms	SMT busbars, current-carrying bars and board-level conductor blocks
Materials	Copper, brass and project-specified conductive alloys
Finishes	Tin, nickel, silver or gold subject to application review
Delivery	Bulk or tape-and-reel for automated placement
RFQ inputs	L × W × T, material, finish, volume and soldering process

ENGINEERING & DFM

End-to-End Support from DFM to Automated Mass Production

Standard selection and equivalent-part assessment

Stamping, machining and finishing coordination

Pick surface, reel and pad design review

Current path, cross-section and temperature-rise review

APPLICATIONS

Application and Selection Context

CASE 01

ESS & inverters

Power-board input/output and device interconnection

CASE 02

Electric vehicles

BMS, PDU, OBC and controller boards

CASE 03

Industrial power

Server PSUs, drives and power modules

FAQ

Engineering & Selection FAQ

QWhat is needed for selection?

Target current, allowable temperature rise, available space, soldering process and estimated volume are the minimum inputs.

QCan you assess an existing brand part?

Yes. Share the current part number, drawing or sample for dimensional, pad, material and packaging review.

Have a part number, drawing or sample?

Share critical dimensions, target current, assembly conditions and volume to agree the DFM review scope and project schedule.

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