CUNECTRACU-AL COMPOSITES · PCB/SMT
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Applications

An interconnect is part of a complete current path.

Understand each requirement in its real installation, load and environment across EV, storage, charging and power-electronics systems.

Vertical Industry Blueprints

Four Core High-Value Hardware Architectures

Tailored hardware architectures solving thermal bottlenecks, space limits, and automated assembly.

01AUTOMOTIVE & ESS

Automotive & Energy Storage BMS

Solving board-level trace clearance, vibration-proof fastening, and daisy-chain interconnects.

Matching Products:
SMT 贴片汇流条SMT 贴片螺母 (M3/M4)铜铝复合过渡端子
Engineering Value:
  • ✓Compare current sharing, resistance and assembly temperature rise
  • ✓Validate mechanical loads under the applicable vibration conditions
  • ✓Validate feeder, nozzle, thermal profile and actual assembly time
View Full Blueprint & BOM→
02DATACENTER & AI

AI Computing & High-Density CRPS PSUs

Tailored for 48V-12V high-current topologies, sub-milliohm shunts and 3D crossover jumpers.

Matching Products:
贴片式电源跳线载流铜块大功率焊接插针
Engineering Value:
  • ✓Compare crossover clearance, signal separation and joint strain
  • ✓Define measurement boundaries and verify loaded voltage drop
  • ✓Confirm coplanarity, stencil, paste and wetting to drawing
View Full Blueprint & BOM→
03PHOTOVOLTAIC & INVERTERS

Solar Micro-Inverters & Storage PCS

Engineered for harsh outdoor environments, high-power AC/DC bus routing and EMC ground shielding.

Matching Products:
PCB 大功率焊接端子接地弹片与屏蔽夹防爬锡大扭力螺柱
Engineering Value:
  • ✓Validate rise with the actual waveform, contacts and cooling
  • ✓Review corrosion, enclosure sealing and service conditions separately
  • ✓Record load direction, fixture and retention before/after exposure
View Full Blueprint & BOM→
04E-MOBILITY & DRIVETRAIN

Automotive OBC & High-Voltage DCDC

Engineered for 800V SiC high-frequency switching circuits with high thermal and creepage safety.

Matching Products:
SMT 贴片螺柱 (M2.5~M6)铜铝过渡连接排高导纯铜贴片排
Engineering Value:
  • ✓Inspect repeated reflow using the actual thermal profile
  • ✓Check thread clearance with the selected geometry, paste and reflow
  • ✓Compare mass at matched function and validation requirements
View Full Blueprint & BOM→

Latest Application Blueprints

Board-level interconnects, mapped to real operating conditions.

Continuously updated long-tail blueprints for engineering, sourcing and program teams.

01EV BMS Application / 800V Interconnect · 8 min read

800V EV BMS PCB Busbar and Cu-Al Transition Terminal Selection Guide

View application blueprint→02AI Server Application / 48V CRPS · 7 min read

48V CRPS AI Server PCB Busbar and 3D Jumper Application Blueprint

View application blueprint→03Solar Storage Application / 1500V PCS · 8 min read

1500V Solar Storage PCS DC Busbar and Cu-Al Conductor Application Blueprint

View application blueprint→

ENGINEERING CONTEXT

Placement yield, current capacity and assembly retention must align.

01

SMT Automation & Feeder Yield

Rigorous control over pick-up surfaces, carrier tape pocket tolerances, and coplanarity to eliminate feeder mispicks and reflow misalignment.

Tape & ReelNozzle flat areaCoplanarity control
02

Board-Level Current & Thermal Rise

Optimized solder wetting area, low contact resistance, and heavy copper conductors to minimize temperature rise and ensure mechanical retention under high load.

Thermal controlTorque retentionSoldering window
03

Precision Tooling & Rapid Prototyping

From 2D/3D CAD and sample reverse-engineering to progressive die stamping, plating, and reel packaging with low-cost prototype validation.

Custom toolingProgressive stampingRapid sampling

RFQ

Describe the requirements to assess project feasibility.

To speed up evaluation, preparing these parameters is recommended. Incomplete drafts are welcome.