SMT Automation & Feeder Yield
Rigorous control over pick-up surfaces, carrier tape pocket tolerances, and coplanarity to eliminate feeder mispicks and reflow misalignment.
CU-AL · CORE PRODUCT LINE
Cu-Al composite busbars, single-/double-sided clad sheets and bars, formed insulated conductors and transition parts. Review copper layout, contacts, processing, temperature rise and environment together; equal cross-section alone does not justify replacing copper.

Copper face, aluminum layer & formed geometry

Insulation, bends & mounting holes

Contact interfaces, fasteners & insulation
Product & application illustrations
View product details →SOLUTIONS
Rigorous control over pick-up surfaces, carrier tape pocket tolerances, and coplanarity to eliminate feeder mispicks and reflow misalignment.
Optimized solder wetting area, low contact resistance, and heavy copper conductors to minimize temperature rise and ensure mechanical retention under high load.
From 2D/3D CAD and sample reverse-engineering to progressive die stamping, plating, and reel packaging with low-cost prototype validation.
PRODUCT SCOPE
Two core businesses: Cu-Al composites and PCB/SMT interconnects. Five categories, six product paths.

Cu-Al composite busbars, single-/double-sided clad sheets and bars, formed insulated conductors and transition parts. Review copper layout, contacts, processing, temperature rise and environment together; equal cross-section alone does not justify replacing copper.

Surface-mount busbars and copper blocks for board-level high-current reinforcement and thermal dissipation, in Tape & Reel packaging.

Metric and inch SMT nuts, standoffs and spacers in Tape & Reel packaging, reflowed directly with SMD components.

SMT tabs, through-hole pins, screw posts and battery contacts engineered for high current capacity, torque resistance and reliability.

20A~70A+ rated arch jumpers for 3D PCB trace clearance, replacing manual wire soldering.

PCB grounding spring clips, shield can clips, heatsink brackets and custom stamped contacts with progressive die stamping.
APPLICATIONS
Battery management sampling terminals, ECU retention nuts, and OBC high-current SMT busbars
Server power booster busbars, paralleled MOSFET conductor blocks, and inverter 3D bridge jumpers
Control board high-current solder terminals, high/low voltage isolation jumpers, and cabinet board interconnects
Multi-layer PCB stacking standoffs, shield can retention clips, ground spring clips, and sensor electrodes
ENGINEERING INSIGHTS
RFQ
To speed up evaluation, preparing these parameters is recommended. Incomplete drafts are welcome.