SMT Automation & Feeder Yield
Rigorous control over pick-up surfaces, carrier tape pocket tolerances, and coplanarity to eliminate feeder mispicks and reflow misalignment.
Tape & ReelNozzle flat areaCoplanarity control
← Back to home
Engineering Solutions
Conditions first. Materials second.
Turn cost, thermal, joint-reliability and manufacturability questions into project inputs that can be validated, quoted and delivered.
Board-Level Current & Thermal Rise
Optimized solder wetting area, low contact resistance, and heavy copper conductors to minimize temperature rise and ensure mechanical retention under high load.
Thermal controlTorque retentionSoldering window
Precision Tooling & Rapid Prototyping
From 2D/3D CAD and sample reverse-engineering to progressive die stamping, plating, and reel packaging with low-cost prototype validation.
Custom toolingProgressive stampingRapid sampling
ENGINEERING REVIEW
DFM Review & Validation Guides
Define drawing inputs, test boundaries and acceptance evidence for packaging, materials, thermal design and assembly. Confirm standards, specifications and qualification records per project.
PROJECT PATH
Four steps from drawings to volume production.
- 01Requirement
Hardware type, quantity, critical dimensions and electrical targets
- 02Drawings / Sample
Provide 2D/3D CAD or send physical sample for coordinate measurement
- 03Engineering DFM
Review progressive tooling, reel carrier tape specs, tolerance and soldering window
- 04Sampling & Volume
Trial placement verification, inspection alignment and volume delivery
ENGINEERING DISCIPLINE
Validating production criteria from SMT placement to board-level electrical duty.
CUNECTRA assesses nozzle flat area, reel pocket tolerance, reflow thermal window, solder wetting, torque retention, and temperature rise to define project-specific tests, acceptance criteria and production confirmation.
FAQ
Direct answers to frequent project questions.
What types of board-level hardware do you supply?+
We specialize in SMT nuts and standoffs, SMT busbars, power jumpers, PCB solder terminals, grounding clips, shield clips, and custom progressive-die stamped hardware.
Are standard parts supplied in Tape & Reel packaging?+
Yes. Most SMT hardware components are supplied in EIA-standard Tape & Reel packaging with high-temperature Kapton pick-up caps for direct feeder mounting.
Can you manufacture custom parts from physical samples without CAD?+
Yes. You can send physical samples; our coordinate-measuring lab will generate 2D/3D CAD drawings and evaluate progressive die tooling.
What is the standard tooling lead time for custom stamped parts?+
Progressive die stamping tooling typically takes 15 to 25 days. Rapid laser-cut or soft-tooled prototypes can be supplied earlier for mechanical fit checks.
Do you support bilingual engineering coordination for export projects?+
Yes. Our engineering and project management teams provide bilingual technical review, unit conversion, and international standard alignment.
RFQ
Describe the requirements to assess project feasibility.
To speed up evaluation, preparing these parameters is recommended. Incomplete drafts are welcome.