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高密度基板と電子自動化実装ラインを強力にサポート。

車載BMS、AIサーバー高密度電源、太陽光・蓄電インバータ、車載OBC向けに大電流＆自動実装ハードウェアを提供。

Vertical Industry Blueprints

Four Core High-Value Hardware Architectures

Tailored hardware architectures solving thermal bottlenecks, space limits, and automated assembly.

01AUTOMOTIVE & ESS

車載・蓄電BMSバッテリー管理システム

Solving board-level trace clearance, vibration-proof fastening, and daisy-chain interconnects.

Matching Products:
SMT 贴片汇流条SMT 贴片螺母 (M3/M4)铜铝复合过渡端子
Engineering Value:
  • ✓Compare current sharing, resistance and assembly temperature rise
  • ✓Validate mechanical loads under the applicable vibration conditions
  • ✓Validate feeder, nozzle, thermal profile and actual assembly time
View Full Blueprint & BOM→
02DATACENTER & AI

AIサーバー＆高密度CRPSチタン電源

Tailored for 48V-12V high-current topologies, sub-milliohm shunts and 3D crossover jumpers.

Matching Products:
贴片式电源跳线载流铜块大功率焊接插针
Engineering Value:
  • ✓Compare crossover clearance, signal separation and joint strain
  • ✓Define measurement boundaries and verify loaded voltage drop
  • ✓Confirm coplanarity, stencil, paste and wetting to drawing
View Full Blueprint & BOM→
03PHOTOVOLTAIC & INVERTERS

太陽光マイクロインバータ＆蓄電PCS

Engineered for harsh outdoor environments, high-power AC/DC bus routing and EMC ground shielding.

Matching Products:
PCB 大功率焊接端子接地弹片与屏蔽夹防爬锡大扭力螺柱
Engineering Value:
  • ✓Validate rise with the actual waveform, contacts and cooling
  • ✓Review corrosion, enclosure sealing and service conditions separately
  • ✓Record load direction, fixture and retention before/after exposure
View Full Blueprint & BOM→
04E-MOBILITY & DRIVETRAIN

車載OBC充電器＆高電圧DCDCコンバータ

Engineered for 800V SiC high-frequency switching circuits with high thermal and creepage safety.

Matching Products:
SMT 贴片螺柱 (M2.5~M6)铜铝过渡连接排高导纯铜贴片排
Engineering Value:
  • ✓Inspect repeated reflow using the actual thermal profile
  • ✓Check thread clearance with the selected geometry, paste and reflow
  • ✓Compare mass at matched function and validation requirements
View Full Blueprint & BOM→

Latest Application Blueprints

Board-level interconnects, mapped to real operating conditions.

Continuously updated long-tail blueprints for engineering, sourcing and program teams.

01EV BMS Application / 800V Interconnect · 8 min read

800V EV BMS PCB Busbar and Cu-Al Transition Terminal Selection Guide

View application blueprint→02AI Server Application / 48V CRPS · 7 min read

48V CRPS AI Server PCB Busbar and 3D Jumper Application Blueprint

View application blueprint→03Solar Storage Application / 1500V PCS · 8 min read

1500V Solar Storage PCS DC Busbar and Cu-Al Conductor Application Blueprint

View application blueprint→

ENGINEERING CONTEXT

実装歩留まり、許容電流、結合強度を高い次元で両立。

01

SMT自動実装と吸着ミスの撲滅

吸着フラット面、エンボステープポケット公差、コプラナリティ（共面度）を厳格管理し、フィーダーの吸着ミスやリフロー時の傾きを防止。

テーピング包装吸着面平坦度共面度管理
02

基板レベルの大電流と温度上昇抑制

はんだ濡れ面積、接触抵抗、導体断面積を最適化し、大電流負荷時の発熱抑制と高トルク締結強度を両立。

熱設計管理耐トルク強度はんだ接合性
03

精密金型開発と迅速な試作対応

2D/3D図面や現物サンプルの三次元測定から順送プレス加工、めっき処理、テーピング実装まで、低コスト試作と量産を支援。

図面金型開発順送プレス試作検証

RFQ

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