CUNECTRACU-AL COMPOSITES · PCB/SMT
CUNECTRA · ENGINEERING

Engineering Collaboration & Project Review

Define drawings, assembly conditions, validation plans and sample acceptance for PCB hardware and power interconnects, with clear inputs and review outputs.

01

Drawing & Interface Review

Define interfaces with the PCB, fasteners and harness before selecting dimensions and processes.

Inputs to prepare

  • Revision-controlled 2D drawings, 3D models and critical dimensions
  • PCB land pattern, installation space and assembly sequence

Review outputs to agree

  • Open dimensions, tolerances and material requirements
  • Acceptance basis for sample and production revisions
02

Electrical & Thermal Validation

Turn the target current into repeatable test conditions; conductor area alone does not establish an equipment rating.

Inputs to prepare

  • Continuous/peak current, duty cycle, ambient and cooling
  • Contact configuration, sensing points and permitted temperature rise

Review outputs to agree

  • Resistance, voltage-drop and temperature-rise test plan
  • Differences between sample test and service conditions
03

SMT, Packaging & Manufacturing Review

Check feeding and soldering against the actual feeder, nozzle, stencil and thermal profile.

Inputs to prepare

  • Mounter/feeder model, pickup surface and feed orientation
  • Finish, solder, reflow profile and expected quantity

Review outputs to agree

  • Packaging and placement conditions requiring line trials
  • Coplanarity, wetting, thread and retention checks
04

Sample Acceptance & Delivery Records

Use agreed drawings and test results to decide the next step. Price and lead time require a project-specific quotation.

Inputs to prepare

  • Sample quantity, inspection methods and milestones
  • Required material, test or quality-system documents

Review outputs to agree

  • Sample results, deviations and remaining approval items
  • Document list with applicable product, scope and validity

Submit Engineering Requirements

sales@cunectra.com