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GLOBAL ENGINEERING & R&D TEAM

Global Engineering & R&D Experts

Anchored by our Dongguan Precision Manufacturing Center, and collaborating with our Stuttgart Automotive Lab and Silicon Valley Computing Consultants, we provide end-to-end support from CAD DFM to automated Tape & Reel mass production.

🇨🇳Dongguan, China (R&D & Tooling Center)

🇩🇪Stuttgart, Germany (Automotive DFM Lab)

🇺🇸Silicon Valley, USA (Server & OCP Hardware)

22+Years Experience

Jianguo Chen

Chief Tooling & Precision Hardware Engineer

📍 Dongguan R&D Center, China

With 22 years specializing in high-precision progressive stamping dies and automotive-grade interconnects, Jianguo has led the development of over 120 high-speed stamping tools. Expert in C1100 copper, beryllium copper, and burr-free continuous stamping for Tier-1 supply chains.

Core Technical Specialties:

Progressive Die StampingSub-0.05mm CoplanarityAutomotive Power TerminalsDFM Analysis

Key Technical Achievements:

✓Led engineering of ≤0.05mm ultra-flat SMT busbar continuous progressive tooling
✓Holds 6 patents on anti-wicking thread and torque-retention stamping geometries
✓Key architect of IATF 16949 automotive stamping quality assurance workflows

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16+Years Experience

Xiaoming Zhang

Senior SMT Automation & Packaging Specialist

📍 Dongguan Engineering Center, China

Former Senior SMT Process Director at tier-1 EMS groups with 16 years on the factory floor. Specializes in feeder automation for odd-form board-level hardware on Panasonic, Fuji, and ASM pick-and-place lines, replacing manual press-fit and flying wires.

Core Technical Specialties:

EIA-481 Reel Carrier DesignVacuum Nozzle Pick-and-Place260°C Reflow ProfilesSMT Placement Yield

Key Technical Achievements:

✓Engineered proprietary Kapton high-temp vacuum pick-up caps with <0.01% mispick rate
✓Standardized EIA-481 embossed carrier tape sealing specs across all SMT standoff lines
✓Supervised automated SMT hardware rollouts across 50+ high-density PCB programs

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14+Years Experience

Zhenhua Liu

Thermal Simulation & High-Current Interconnect Architect

📍 Shenzhen / Dongguan Labs, China

M.S. in Electrical Engineering from Huazhong University of Science and Technology. Focuses on sub-milliohm power distribution and thermal modeling, helping hardware teams eliminate costly 4oz+ thick copper PCB layers using surface-mount busbars.

Core Technical Specialties:

Joule Heating FEM SimulationPCB High-Current Trace ShuntingDC Resistance & Thermal RiseCu-Al Interconnects

Key Technical Achievements:

✓Developed the CUNECTRA thermodynamic Joule heating & ampacity regression engine
✓Enabled 120A+ single-board continuous power distribution for ESS and server PSUs
✓Published 4 papers on power semiconductor packaging and board-level heat dissipation

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20+Years Experience

Dr. Marcus Weber

Director of European Automotive Applications & DFM

📍 Stuttgart, Germany

Ph.D. in Materials and Mechanical Engineering from RWTH Aachen University with 20 years in the European automotive industry. Formerly with leading German automotive suppliers, leading DFM reviews and qualification for e-mobility and BMS hardware.

Core Technical Specialties:

Automotive BMS InterconnectsISO 26262 Functional SafetyEuropean Tier-1 StandardsHarsh Environment Validation

Key Technical Achievements:

✓Supervised component validation following German Automotive VDA 6.3 standards
✓Supported 800V high-voltage EV busbar and jumper cross-matching for European OEMs
✓Provides European clients with direct technical DFM reviews and compliance support

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18+Years Experience

David R. Miller

North American Power & Computing Hardware Consultant

📍 Silicon Valley (San Jose, CA), USA

UC Berkeley Electrical Engineering graduate with 18 years consulting for hyperscale data centers, server power suppliers, and industrial inverter manufacturers in North America. Connects Silicon Valley engineers with Dongguan rapid tooling.

Core Technical Specialties:

AI Server CRPS Power SuppliesOCP Open Compute Standards48V High-Current TopologiesRapid Prototyping DFM

Key Technical Achievements:

✓Co-architected 48V-12V board-level current jump solutions for next-gen AI GPU servers
✓Established 48-hour DFM engineering turnaround and 5-day rapid sampling channel
✓Senior IEEE Power Electronics Society member and frequent speaker on hardware design

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ENGINEERING CONSULTATION

Speak Directly with Our Senior Engineers

Share your PCB layout drawings, thermal rise targets, or odd-form fastener requirements for a 1-on-1 DFM review and rapid sample matching.

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