In power supplies, motor drives, and inverter boards, high-current power rails frequently need to cross dense low-voltage signal buses. The traditional approach uses 6-layer or 8-layer boards with internal 2oz/3oz heavy copper planes, inflating fabrication costs. SMT 3D power jumpers enable high-current 3D flyovers on economical 2-layer or 4-layer standard boards.
Thermal Bottlenecks & Multiplier Costs of Internal Heavy Copper Layers
Routing 50A through internal PCB layers is thermally constrained by the low thermal conductivity of FR4 resin (0.25 W/m·K), trapping heat and creating 60K+ local hot spots. Furthermore, blind/buried vias and heavy copper internal stackups increase bare PCB costs by 150%~280%.
C1100 Pure Copper 3D Arch Bridge Architecture
CUNECTRA SMT power jumpers are stamped from 0.8mm~1.5mm high-conductivity pure copper (100% IACS) into a rigid 3D arch profile. Spanning 8mm to 25mm with 1.2mm~2.5mm bottom air clearance, low-voltage signal lines pass underneath safely and without capacitive crosstalk.
- Continuous Current Rating: 20A to 70A per jumper (surge pulse > 150A)
- DC Resistance (DCR): < 0.15 mΩ, keeping conduction loss in the milliwatt range
- Air Clearance: ≥ 1.5mm under bridge, meeting 48V/60V safety creepage specs
- Low-Profile Height: Overall height < 3.8mm, compatible with standard low-clearance enclosures
Convective Air Cooling & Tape & Reel Automated Placement
Elevated in free air, the jumper exchanges heat directly with chassis airflow, reducing operating temperature rise by over 45% compared to internal traces. Equipped with a high-temperature polyimide pick-up cap, jumpers are packaged in standard EIA-481 Tape & Reel for automated SMT placement, eliminating costly manual wire soldering.