Key Engineering & Assembly Failure Modes
Conductivity versus spring function
Conductors and spring contacts have different constraints. Review resistivity, strength, springback and temperature for each function.
Whiskers and interface changes
Matte tin or nickel underplate cannot guarantee elimination of all tin-whisker risk. Review spacing, processing, environment and the applicable reliability plan.
Environmental-test extrapolation
Salt mist, humidity and vibration results apply to stated samples and conditions; they do not directly establish field service life.
Review material and finish by function
CUNECTRA STANDARD SPEC| Function | Inputs | Evidence |
|---|---|---|
| Current conductor | Temper, section, current and temperature | Material certificate, resistance and temperature-rise records |
| Spring contact | Deflection, contact force, cycles and temperature | Force/displacement, relaxation and contact resistance |
| Solder surface | Layer thickness, solder, storage and profile | Finish measurement, wetting and joint inspection |
| Corrosion protection | Mating metals, moisture, salt, seals and edges | Appearance, resistance and function before/after exposure |
Design for Manufacturability Guidelines
Specify material condition
Record grade, temper, thickness and test method on the drawing and purchase requirements.
Separate functional zones
Identify solder, sliding contact, thread and cut-edge zones with their own finish and inspection requirements.
Frequently Asked Questions
Does matte tin guarantee freedom from whiskers?+
No. Specify process, underplate, stress, environment and testing, then evaluate the system risk.
Do salt-spray hours establish outdoor life?+
Not alone. Connect the method, assembled state and corrosion mechanism to the intended environment.